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Lehae > Litaba > Leboea Leboea la Amerika Leboea le lebelletsoe ho fihlella US $ 5 billion ka lekeno ka 2026

Leboea Leboea la Amerika Leboea le lebelletsoe ho fihlella US $ 5 billion ka lekeno ka 2026

Ho latela liphetho tsa morao-rao tsa lipatlisiso tsa Lefapha la Patlisiso ea Graphical ka la 22 Pherekhong (Patlisiso ea Graphical), ho 2019, lekhetho le tsoetseng pele la theknoloji ea ho paka ea Amerika Leboea le feta lidolara tse limilione tse likete tse tharo mme ho lebelletsoe hore le tla fihla ho $ 5 billion ka 2026, ka sekhahla sa kholo ea selemo le selemo ea 7%.

Sesosa se ka sehloohong sa ho hola ha liphutheloana tsa Amerika Leboea ke hore bongata ba lihlahisoa tsa elektroniki tse sebetsang hantle li ntse li fetoha le ho feta, e leng se khothalletsang nts'etsopele ea mahlale a ho paka ka tsela e tsoetseng pele.

Flip chip mokhoa

Ntle le ts'ebetso ea miniaturization ea lisebelisoa tsa elektroniki, tharollo e tsoetseng pele ea ho paka e boetse e na le menyetla e mengata, ho kenyeletsoa leoto le lenyane, ts'ebeliso e tlase ea matla le khokahano e ntle ea chip.

Flip chip method (buluu bo lefifi setšoantšong se kaholimo) butle-butle e fetohile mokhoa o tloaelehileng oa ho paka

Har'a tsona, mokhoa oa ho phethela chip (Flip Chip) o lebelletsoe ho hola ka sekhahla sa kholo ea selemo le selemo ea 5% pele ho 2026. Karolo ena e se e ikarabella ho feta 60% ea lekhetho la mmaraka ka 2019. Ha e bapisoa le lihlahisoa tse ling tse fapaneng, Chip theknoloji ea -on-chip ha e fane feela ka boleng bo phahameng ba tlhahiso, empa hape e na le leoto le nyane. Sena se e etsa khetho e tloaelehileng ea liphutheloana ho lisebelisoa tsa elektroniki tsa bareki.

Ntle le moo, mahlale a marang-rang a ka lumella metheo ho etsa tlhahiso ea bongata, e baka kholo e kholo mmarakeng o tsoetseng pele oa ho paka oa Amerika Leboea.